BWCMAQB11T08GI BWCMAQB11T16GI BWEFMI032GN2RJ BWEFMI064GN223 BWEFMI128GN223 BWEFMA064GN1KC BWEFMA128GN1KC
TGE218 eMMC 5.1 integrates a robust industrial controller with premium TLC NAND
TGE218 eMMC5.1 HS400 TLC NAND PSLC 8GB BWCMAQB11T08GI
Description:
TGE218 eMMC 5.1 integrates a robust industrial controller with premium TLC NAND for mission-critical applications (for example, power and other utilities) requiring exceptional reliability, high read/write performance, and long-term stability. Supporting a wide industrial temperature range of -40°C to +85°C, the TGE218 ensures stable operation even under extreme environmental conditions.
The TGE218 uses an FBGA 153 ball package and adheres to the eMMC 5.1 standard, supporting HS400 high-speed mode to deliver optimal read/write performance. It includes essential features such as FFU (Field Firmware Upgrade), Boot Partition, RPMB (Replay Protected Memory Block), and idle data acceleration, providing comprehensive functionality for enterprise-level applications. With customizable options, extended product lifecycle and reliable supply chain, the TGE218 is ideal for industrial deployments requiring extended availability and robust support.
The TGE218 offers optional support for pSLC (pseudo-SLC) mode, enabled via BIWIN’s proprietary firmware algorithm. The pSLC makes MLC function like SLC, significantly increasing write endurance, reliability, and performance.
Specification:
Industrial-Grade eMMC 5.1 with Optional pSLC Mode, Extended Temp Range, and Reliable Data Integrity
Optional pSLC Mode for Higher Endurance
-40°C to +85°C Wide-temp Stability
Comprehensive Data Protection
Application:
Smartphones
Video Surveillance
Smart Wearables
Smart Speakers
Networking Products
Tablets
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